Product model: ZL - XFJ - 5000 (groove packaging machine) Application of function: used for milling encapsulated in standard card base required different chip card slot, and at the same time, different specifications of the chip testing, gluing, die cutting, and implant to have been milling card slot, IC packaging assembly line. Main function: 1. The collection of slotting, vacuum cleaner and depth detection. 2. Professional fixture design, make the groove depth is not affected by card thickness and size to slot milling precision. 3. The preset 4 kinds of standard module slot milling procedures, according to actual needs to adjust, convenient modification parameter. 4. Separate groups of X, Y worktable, solve the difficult problems of a modified slot milling centre. 5. The Z axis milling groove depth by the high precision servo drive the guide rail, screw to complete action, solved the difficult problem of tool change. 6. Depth detection device, ensure mechanical grooving percent of pass. 7. The module into the precise photoelectric sensor monitoring, automatic identification of good or bad. 8. Glue adopt unique flat structure and multiple heating head, solve high temperature adhesive glue problem. When replacing welding head need not adjust plane. 9. Chip move adopt servo drive the high precision the guide rail, screw, move send position to modify parameters. 10. Hot welding adopts unique flat structure, to ensure that the packaging does not glue phenomenon. Change the welding head don't have to readjust the plane. Multiple sets of hot welding to ensure the packaging quality. 11. Cards sent by servo drive belt to complete the action to ensure the security and stability of the machine. 12. Personality perfect software design, make the mechanical operation is more fast and convenient. 13. Chip ATR detection device, ensure mechanical encapsulation percent of pass. 14. Unique pin structure, to avoid the twin phenomenon due to static electricity.